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We provide "turnkey" solutions for all your micromachining vacuum packaging needs. This includes getter integration, wafer bonding for chip-scale packages, ceramic packages and getter activation. NanoGetters has been used with solders, glass reflow and vacuum welded lids in addition to wafer to wafer bonding.
“NanoGetters® Technology has improved our ability to obtain and hold low pressures in our MEMS resonators. We consistently get high Q
values, as high as 20,000, with our resonators using NanoGetters®.”
- Jim Cripe, MEMS Test Engineer.