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News & Publications

Vacuum & CoatingNanoGetters to Deliver Talk on MEMS Vacuum Packaging at COMS 2011
- August, 2011

Webinar on MEMS Vacuum Packaging
- April, 2011

NanoGetters Awarded New Getter Patent
- November, 2010

Thin Film Getters for Wafer-Scale MEMS - Wafer & Device Packaging & Interconnect
- July, 2010

Thin Film Getters: Solid State Vacuum Pumps for Microsensors and Actuators – Vacuum Technology & Coating
- April, 2010

Reliable MEMS Vacuum Packaging for Aerospace Applications, MEMS & Sensors for Aerospace Applications 2010
- April, 2010

NanoGetters increases 8” wafer capacity
- March, 2010

NanoGetters reported at Transducers'09 to enhance long-term reliability of gold eutectic wafer bonding
- June, 2009

Vacuum Packaging Using Au-Si Eutectic Bonding, data from a 4 year reliability lifetest, Univeristy of Michigan
- May, 2009

Industrial MEMS-based resonant Coriolis mass flow meter uses NanoGetters – IEEE Transactions on Industrial Electronics
- April, 2009

MEMS 2008 Conference, NanoGetters used with gold-indium solder bonding process
- January, 2008

Vacuum & CoatingGold Silicon Eutectic Wafer Bonding Technology for Vacuum Packaging; University of Michigan/WIMS Poster on the Reliability of Eutectic Vacuum Packaging using Nanogetters®
- October 24, 2006

An all-glass chip-scale MEMS package with variable cavity pressure; Journal of Micromechanics and Microengineering
- October, 2006

Nanogetters® expands its manufacturing infrastructure for high-volume production
- September, 2006

University of Michigan Presents Paper discussing Results of using Nanogetters® at Conference
- June, 2006

NASA publishes final report on MEMS getters, see pages 17-27 for NanoGetter information

Navy Surface Warfare Awarded a Phase I SBIR to ISSYS, Inc. for the Developing an Improved Vaccuum Packaging Process for Advanced Inertial Sensors using NanoGetters®
- August 30, 2005

ISSYS, Inc./NanoGetters® Awarded New Patent for Getter and Hermetic Packaging Method
- August 25, 2005

Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs
Journal of Micromechanics and Microengineering - June 28, 2005

ISSYS Achieves ISO9001:2000 Certification
- December 16, 2004

NanoGetters® presents paper entitled, "Wafer-Level, Low-Cost, High-Vacuum Packaging of MEMS Devices Using NanoGetters®" at the Fall 2004 Meeting of the American Vacuum Society (AVS).
- November 18, 2004

DARPA Awarded Grant to ISSYS for the Commercialization of its Prorietary Vacuum Packaging Technology NanoGetters®
- October, 2004

Reliable Packaging using Nanogetters® and Glass Frit Bonding
- SPIE, Jan. 2004

Chip-Level Vacuum Packaging of Micromachines Using NanoGetters®
- IEEE Transactions on Advanced Packaging, Vol. 26, Aug. 2003


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