||MEMS fabrication is a batch process, yielding
thousands of per run. Dicing is the process of separating the
batch of sensors on a wafer into individual sensors that can
be assembled into the complete product.
|Assembly & Packaging
||Assembling individual components into complete
products or sub-systems is an essential element of ISSYS' strategy.
ISSYS has the capability to design and produce the required
electronics and packaging to produce a complete product.
|Testing & Characterization
||ISSYS' testing and characterization labs provide
feedback for research and development as well as information
on finished sensor performance required to appropriately calibrate
the sensors. Because ISSYS is developing state-of-the-art sensors,
testing and characterization equipment must frequently be custom
designed and built.