Manufacturing & Facilities: Dedicated Fabrication Facility

Located in Ypsilanti, Michigan, ISSYS' facility is just a short drive from either Ann Arbor or Detroit Metropolitan airport. The 11,000 square foot facility includes nearly everything required for the design, development, and production of MEMS-based products

ISSYS' facility supports both production and research and development activities. Production is completed in clean rooms, chemical labs, and a back-end packaging and production area supported by specialized utilities and waste disposal capabilities. Design and testing is completed in ISSYS' computer simulation lab, sensing and electronics characterization and testing labs , prototype machine shop , and ISSYS' offices.

ISSYS Class 100 Clean Room

Dedicated Fabrication Facility/Clean Rooms:

To consistently and repeatably produce its products, ISSYS has established a comprehensive, quality-focused MEMS manufacturing facility including a certified Class 100 Clean Room, chemical labs, characterization labs, and centralized utilities.

ISSYS' two clean rooms house the bulk of ISSYS' MEMS-fabrication equipment, including:

  • Sputter Deposition System
  • STS Deep Reactive Ion Etcher
  • Plasma Oxygen Asher
  • Solvent Bench
  • Acid/Base Benches
  • Photoresist Spin Coater
  • Rinser/Dryer Tools
  • Evaporator
  • Programmable Ovens
  • Electronic Visions Aligner
  • Electronic Visions Bonder
  • Mega Sonic Cleaner
  • Ultra Sonic cleaner
  • Screen printer for glass frit handling

Chemical Labs:

ISSYS operates two independent chemical laboratories to support its MEMS processes. The first laboratory supports DWP and KOH wet chemical etching processes, including the EDP Reactor Cell. The second laboratory is dedicated to the development and characterization of corrosion-resistant technologies. Both chemical laboratories are equipped with permanent full-faced fume hoods.

Assembly, Characterization & Testing Laboratories:

Environmental chamber & other testing equipment

ISSYS' characterization laboratories provide feedback for individual process steps and finished sensor performance.

ISSYS' assembly and packaging equipment includes:

  • Microelectronics Wafer Dicing Saw
  • Wire Bonder
  • Automated Drill

ISSYS' test and characterization equipment includes:

  • WYKO Optical Profilometer
  • Dektak Profilometer
  • Scanning Electron Microscope (SEM)
  • Optical microscope
  • Stereo Microscopes
  • Nanoscope
  • Force Pull Tester
  • Wet/Dry Vented Hoods
  • Function Generator
  • Universal Source
  • Probe Stations Optical Microscopes
  • Corrosive Gas Exposure System
  • Helium Leak Test Tool
  • Environmental Test Chamber
  • Custom-Made Pressure Characterization System
  • LCR Meter
  • Gain Phase Analyzer
  • Oscilloscopes

Prototype Machine Shop:

To permit fast and cost-effective turnaround on prototype packaging options, ISSYS has an in-house machine shop.

Specialized Utilities:

ISSYS has installed specialized utilities to support its design and manufacturing processes.

To maintain the ultra-clean environment required to manufacture MEMS devices and support its equipment, ISSYS has installed specialized utilities including:

  • Dedicated 480 volt electrical service
  • 18 megaohms-cm deionized water system
  • Chilled water system
  • Dedicated nitrogen, compressed air, and vacuum supplies
  • Comprehensive hazardous waste management system
  • Cold storage facility for chemicals

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