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CAPABILITIES
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» Manufacturing Facilities

Manufacturing Facilities

Located in Ypsilanti, Michigan, ISSYS' facility is just a short drive from either Ann Arbor or Detroit Metropolitan airport. ISSYS´s facility supports both production and research and development activities. Production is completed in clean rooms, chemical labs, and a back-end packaging and production area supported by specialized utilities and waste disposal capabilities. Design and testing is completed in ISSYS' computer simulation lab, sensing and electronics characterization and testing labs, prototype machine shop, and ISSYS' offices.

ISSYS´s comprehensive manufacturing infrastructure has the following advantages:

  • R&D, Prototyping, and Full Manufacturing Under One Roof
  • Comprehensive ISO 9001:2008 Certified Quality System
  • Medical Device Design Control process consistent with the FDA Quality System Regulation and ISO 13485:2003 requirements
  • Production of Multi-Million Bio-MEMS Units Per Year
  • Flexible Manufacturing (Rapid Prototyping and Production of Diverse Medical and Industrial MEMS-Based Products)
  • System Level Products (MEMS, Electronics, Assembly, Packaging, Testing)

Cleanrooms
ISSYS operates two Class 100 clean rooms to house ISSYS´s MEMS-fabrication equipment. Standard wafer sizes are 4 inch (100 mm) and six inch (150 mm) diameters, and we have some additional capabilities for running 8 inch (200 mm) wafers.

Chemical Labs
ISSYS operates two independent chemical labs to support its MEMS processes. These chemical labs support the EDP and KOH wet chemical etching processes, including the high volume EDP reactor cell. Both chemical labs are equipped with permanent full-faced fume hoods.

Equipment
MEMS fabrication tools include:

  • STS Pegasus Deep Reactive Ion Etcher
  • STS ICP Deep Reactive Ion Etcher
  • Photo-Resist Spinner
  • EVG Aligner
  • OAI Aligner
  • EVG Bonder (Anodic, Fusion, Frit)
  • AML Bonder (Anodic, Fusion, Frit)
  • Megasonic Cleaner
  • High Temperature Furnaces
  • Sputter Deposition System
  • Two E-Beam Evaporators (one high volume, one R&D)
  • Plasma Oxygen Asher
  • Solvent Bench
  • Acid/Base Benches
  • Rinser/Dryer Tools (4 sets)
  • Programmable Ovens
  • Ultra Sonic Cleaner
  • Liftoff Modules
  • Screen Printer for Glass Frit Printing
  • EDP Reactor Cell
  • KOH System

ISSYS´s characterization labs provide feedback for individual process steps and finished sensor performance. ISSYS´s test and characterization equipment includes:

  • WYKO Optical Profilometer
  • Nanospec Thin Film Measurement System
  • Scanning Electron Microscope (JOEL)
  • Mechanical Profilometer
  • Wafer Particle Counter
  • Probe Stations
  • Optical Microscopes
  • Stereo Microscopes
  • Environmental Test Chambers
  • Custom-Made Pressure Characterization System
  • Vacuum Probe Station
  • Fluid Analyzer (Anton Paar)
  • A variety of NIST-Traceable Calibration Standard Tools
  • LCR Meters, Multimeters, Gain Phase Analyzers & Oscilloscopes

Other in-house tools include:

  • Wafer Dicing Saw
  • Wire Bonder
  • Pick and Place Assembly Machine
  • Automated Dispensing System
  • Ovens
  • Automated MicroDrilling System
  • Micro-Scales
  • Helium Leak Test Tool
  • Corrosive Gas Exposure System
  • Wafer Grinder
  • Laser Welder
  • Ultrasonic Welder
  • Custom-Designed Characterization Systems
  • Wet/Dry Vented Hoods

To permit fast turnaround on maintenance, repair, and prototype packaging options, ISSYS has an in-house machine shop with a variety of tools (e.g., lathe, drill, and mill).

To maintain the ultra-clean environment required to manufacture MEMS devices and support its equipment, ISSYS has installed specialized utilities including:

  • DI Water
  • Pure Nitrogen
  • Comprehensive Piped Waste Management System
  • Compressed Air (2 generators)
  • Vacuum
  • Chilled water
  • Large Chemical Cold Storage Room
  • Fire and Security Monitoring System
  • Dedicated Power Supply (480V, 208V, 3 phase)
  • Uninterrupted Power Supply for the Entire Cleanroom Facility

Contact us today to learn more about our Processing Capabilities.