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ISSYS Announces Opening of New Fabrication Line

Ann Arbor, Michigan: ISSYS Inc. is pleased to announce that it completed construction of a 1000 sq. ft. of class 100 clean room as part of its program to expand in house MEMS processing and diagnostic capabilities. The clean room will include state of the art MEMS fabrication equipment such as deep reactive ion etchers, thick resist coaters, aligners, anodic bonders, metal and dielectric sputtering systems. In addition to these ISSYS will also be equipping the clean room with complete diagnostic and inspection tools such as the WYKO; (vertical profiler) microscope, scanning electron microscopes, optical microscopes with fluorescence microscopy for residue detection, and film thickness measurement systems.

ISSYS will also have complete wet-processing capabilities both inside and outside the clean room for silicon etching at wafer thickness levels, oxide, nitride and metals wet etching, glass etching, and pre-furnace cleaning. ISSYS is also considering to acquire Deep RIE equipment and atmospheric and LPCVD furnaces for diffusion, oxidation and deposition of silicon dioxide and nitride. Outside the clean room ISSYS will be equipped with MEMS capable back-end and packaging equipment such as drills, dicing saw, die bonder, epoxy dispenser and wire bonder.

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