ISSYS ISSYS

Employment Opportunities

Current Openings:


ASIC DESIGNER
REQUIRED QUALIFICATIONS/SKILLS
  • 5+ years of industrial design experience
  • Analog ASIC t and printed circuit board level design
  • Modeling and layout experience
  • Bench level troubleshooting skills
  • Ability to work through external CMOS foundries
  • Sensor interface design experience desired
  • Good teamwork and communication skills
  • Ability to work in a dynamic small technology company environment
OTHER QUALIFICATIONS
  • Detailed Oriented
  • Document information accurately and legibly
  • Capability to convey confidence in finding final outcome of products or processes
  • Work independently or in a team environment
COMPUTER / SOFTWARE
  • Circuit Simulation Software
  • Layout Software
EDUCATION
  • BS in Electrical/Electronic Engineering (MS EE preferred)

If you meet the necessary requirements, please forward your resume to lwest@mems-issys.com

 


 

ELECTRONICS ENGINEER
RESPONSIBILITIES
Research, design and implement electronics needed for ISSYS products. Plan and oversee system architecture of electronics through developmental stages. Also include planning detail and researching design options.

REQUIRED QUALIFICATIONS/SKILLS
  • Analog and Digital circuit design
  • Design analog and digital circuits using CAD software, test procedures, design and write firmware, software using appropriate computer and embedded language (Labview, C, Assembly)
  • Design for EMI technology and stability testing
  • Knowledge of product development
  • Posses high level of circuit aptitude and programming skills
  • Understanding of control systems theory
  • Ability to analyze and model data using Excel and Visual Basic for Applications
PREFERRED QUALIFICATIONS
  • Knowledge of MEMS
  • Detailed Oriented
  • Document information accurately and legibly
  • Capability to convey confidence in finding final outcome of products or processes
  • Work Independently or in a team environment
COMPUTER / SOFTWARE
  • SPICE
  • C, Labview, Visual Basic for Applications, Assembly
  • Experience in modeling (MATLAB) or equivalent
  • Knowledge of PCB layout software
EDUCATION
  • Bachelor in Electrical Engineering or Electrical Engineering Tech with 5 yrs experience, or MS In Electrical Engineering
LEVELS
  • This position has three levels (I, II, III) depending on experience and education.

If you meet the necessary requirements please forward your resume to dsparks@mems-issys.com

 


 

SOFTWARE ENGINEER
RESPONSIBILITIES
Researches, designs and develops computer software systems, in conjunction with hardware product development for medical and industrial devices.

REQUIRED QUALIFICATIONS/SKILLS
  • 5+ years experience with Embedded C and Labview
  • Experience designing and debugging analog and digital circuits
  • Knowledge of FDA 21 CFR820 Quality Systems Regulation, and FDA Good Documentation Practices
  • Experience conducting FDA/IEC 62304 SDLC S/W Validation and Verification
  • Knowledge of ISO 13485-2003 and ISO 14971
EDUCATIONAL QUALIFICATIONS
  • Bachelors in Computer Science or Electrical Engineering
  • Masters Degree preferred

If you meet the necessary requirements please forward your resume to dsparks@mems-issys.com

 


 

MEDICAL DEVICE DIRECTOR
RESPONSIBILITIES
Project lead for a wireless, implantable medical device, heading up a collaborative team that interfaces with engineering, medical and regulatory personnel.

REQUIRED QUALIFICATIONS
  • 5+ years experience in project management
  • Product development experience
  • Personnel supervision
  • Experience with medical device
ADDITIONAL DUTIES AND/OR RESPONSIBILITIES INCLUDE
  • Background in biomedical engineering
  • Instrumentation experience
  • Familiarity with FDA device regulations
EDUCATIONAL QUALIFICATIONS
  • Bachelors Degree in related area
  • Masters Degree preferred

If you meet the necessary criteria, please forward your resume to lwest@mems-issys.com

 


 

PROCESS OPERATOR
DUTIES AND/OR RESPONSIBILITIES INCLUDE
  • Perform MEMS processing work, as directed. Possibilities include all front-end or back end processing step back-end processing steps including:
    • Thermal Oxidation
    • Boron Diffusion and Drive-in
    • LPCVD deposition of different thin films
    • PVD such as evaporation and sputtering
    • RIE and DRIE
    • Wet processing
    • Microphotolithography, Bonding, CMP, Chemical and Mechanical planarization
  • Involved in continuous process improvement
  • Work as owner for different semiconductor equipment, such as STS DRIE, Megasonic Cleaner and wet bench modules, responsibilities include developing SOP, developing process, setup parameters, developing or performing maintenance, as directed or needed.
REQUIRED QUALIFICATIONS
  • Ability to run process equipment as directed
  • Minimum of 3 years MEMS/ semiconductor manufacturing and equipment experience
  • Interact closely with production / product groups to execute the process needs
  • Conduct various phases of improvement projects
  • Support / Maintain equipment as directed
  • Industrial Engineering Training / experience desirable
EDUCATIONAL QUALIFICATIONS
  • B.S. Electrical Engineering

If you meet the necessary criteria, please submit resume to lwest@mems-issys.com


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