News & Publications : Audio Video Profiles

This webinar focuses on vacuum packaging technologies for a variety of MEMS devices. These include traditional metal and ceramic packages as well as numerous wafer-to-wafer bonding techniques. MEMS processing methods including wafer preparation, etching, and getter incorporation are discussed, as well as a number of MEMS applications requiring vacuum packaging.

ISSYS gave the following webinar on MEMS flow and density sensing technology on 2/2/2011

NASA selected a few companies as part of their Hallmark of Success. ISSYS is honored to be one of them.
The video tape below is provided by NASA showing ISSYS as a Hallmark of Success Company:

• See the NASA Video

• 56K
• DSL/Cable
• T1