MEMS Foundry Services: Technical & Design
If you need assistance in one specific part of a project, ISSYS can help. We offer most portions of our turnkey services on an individual basis. These services include:
Sensor Design - Experienced ISSYS designers can help you design and construct your sensor using Tanner tools or model your designs with ISSYS' finite element analysis (FEA) using ANSYS software.
Readout Electronics - ISSYS circuit design engineers can assist with design of both application specific integrated circuits (ASICs) and PC boards.
Process Development - For most MEMS devices, the device and process design are intimately linked. ISSYS engineers are experienced in a wide array of processing techniques and can give you the most flexibility in developing a process that works with your design. ISSYS has experts in surface, bulk, and dissolved wafer processing.
Packaging - Widely recognized as one of the biggest hurdles in device development, packaging has been one of ISSYS' focal points for years. In fact, ISSYS now has patents pending on several MEMS packaging techniques. Our designers can help you interface your devices with the outside world, and even build in corrosion resistance at the packaging level.
Please contact us for more information about how we can help you realize your product dreams.
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